![](/img/cover-not-exists.png)
[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - On-package magnetic materials for embedded inductor applications
Li, Liangliang, Lee, Dok Won, Hwang, Kyu-Pyung, Min, Yongki, Wang, Shan X.Year:
2009
Language:
english
DOI:
10.1109/ICEPT.2009.5270707
File:
PDF, 3.58 MB
english, 2009