[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Influence of surface morphology on the adhesion strength of plated Cu on the build-up layer within an embedded active package
Huang, Yu-Wei, Hung, Yin-Po, Cheng, Ren-Shin, Chang, Tao-Chih, Lee, Ching-Kuan, Chen, Tai-HongYear:
2010
Language:
english
DOI:
10.1109/IMPACT.2010.5699595
File:
PDF, 249 KB
english, 2010