[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Reliability assessment of the 20 um pitch micro-joints within a 3DIC assembly under various environments
Huang, Shin-Yi, Chang, Tao-Chih, Cheng, Ren-Shin, Chang, Jing-Yao, Leu, Fang-Jun, Lu, Yu-Lan, Yang, Tsung-FuYear:
2010
Language:
english
DOI:
10.1109/IMPACT.2010.5699594
File:
PDF, 3.22 MB
english, 2010