Degradation Mechanisms of Au–Al Wire Bonds During...

IEEE Transactions on Device and Materials Reliability 2008 / 09 Vol. 8; Iss. 3

Degradation Mechanisms of Au–Al Wire Bonds During Qualification Tests at High Temperature for Automotive Applications: Quality Improvement by Process Modification

Bahi, Manoubi Auguste, Lecuyer, Pascal, Gentil, Annabelle, Fremont, HÉlÈne, Landesman, Jean-Pierre, Christien, FrÉdÉric, Le Gall, RenÉ
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Volume:
8
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/TDMR.2008.2001703
Date:
September, 2008
File:
PDF, 568 KB
english, 2008
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