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[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - New strategy to improve the mechanical strength and to reduce potential contamination of dielectric materials for double level metal integration
Assous, M., Morand, Y., Demolliens, O., Berruyer, P., Manierre, B., Gobil, Y., Louis, D., Feldis, H., Vizioz, C., Roman, A.Year:
2000
Language:
english
DOI:
10.1109/IITC.2000.854291
File:
PDF, 316 KB
english, 2000