[IEEE 2012 13th International Conference on Electronic...

  • Main
  • [IEEE 2012 13th International...

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Low latency compute node architecture cooled by a two phase fluid flow

Wang, Qidong, Guidotti, Daniel, Wan, Lixi, Cao, Liqiang, Cui, Jie, Lin, Fujiang, Zhu, Guang, Wang, Qian, Ye, Tianchun
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2012
Language:
english
DOI:
10.1109/ICEPT-HDP.2012.6474573
File:
PDF, 2.03 MB
english, 2012
Conversion to is in progress
Conversion to is failed