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[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Component level reliability on different dimensions of lead free wafer level chip scale packages subjected to extreme temperatures
Thirugnanasambandam, Sivasubramanian, Jiawei Zhang,, Evans, John, Fei Xie,, Perry, Matt, Lewis, Brian, Baldwin, Daniel, Stahn, Kent, Roy, MichelYear:
2012
Language:
english
DOI:
10.1109/ITHERM.2012.6231485
File:
PDF, 1.19 MB
english, 2012