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[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Finite Element Modeling of Thermoelastic Damping in Filleted Micro-Beams
Lepage, Severine, Golinval, Jean-ClaudeYear:
2007
Language:
english
DOI:
10.1109/ESIME.2007.359939
File:
PDF, 6.80 MB
english, 2007