SiC Die Attach Metallurgy and Processes for Applications up...

IEEE Transactions on Components Packaging and Manufacturing Technology 2011 / 04 Vol. 1; Iss. 4

SiC Die Attach Metallurgy and Processes for Applications up to 500 $^{\circ}{\rm C}$

Hagler, Ping, Johnson, R. Wayne, Chen, Liang-Yu
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Volume:
1
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2011.2106160
Date:
April, 2011
File:
PDF, 2.31 MB
english, 2011
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