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[IEEE 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium - Petaling Jaya, Malaysia (2007.11.8-2007.11.10)] 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium - The Solutions of Resistive Ball Bond Failure in Ultra Fine Pitch Wire Bonding
Ibrahim, Mohd Rusli, Teck, Siong Chin, Choi, Yong ChengYear:
2006
Language:
english
DOI:
10.1109/IEMT.2006.4456480
File:
PDF, 4.70 MB
english, 2006