[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - A novel Wafer level Fan-out Package (WFOP™) applicable to 50um pad pitch interconnects
Hayashi, Naoki, Takahashi, Tomoko, Shintani, Nobuaki, Kondo, Takanori, Marutani, Hisakazu, Takehara, Yasuyuki, Higaki, Kiichiro, Yamagata, Osamu, Yamaji, Yasuhiro, Katsumata, Akio, Hiruta, YoichiYear:
2011
Language:
english
DOI:
10.1109/EPTC.2011.6184515
File:
PDF, 1.15 MB
english, 2011