A shear-based optimization of adhesive thickness for die...

IEEE Transactions on Components Packaging and Manufacturing Technology Part A 1995 / Sept. Vol. 18; Iss. 3

A shear-based optimization of adhesive thickness for die bonding

Hokanson, K.E., Bar-Cohen, A.
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Volume:
18
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.465155
Date:
January, 1995
File:
PDF, 629 KB
english, 1995
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