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[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Development and characterization of new generation panel fan-out (P-FO) packaging technology
Chang, Hong-Da, Chang, David, Liu, Kenny, Hsu, H.S, Tai, Rui-Feng, Huang, Hsiao-Chun, Lai, Yi-Che, Lu, Chang-Lun, Lin, Chun-Tang, Chiu, SteveYear:
2014
Language:
english
DOI:
10.1109/ECTC.2014.6897402
File:
PDF, 1.74 MB
english, 2014