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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Hot-forming of micro glass cavities for MEMS wafer level hermetic packaging
Shang, Jintang, Liu, Junwen, Xu, Chao, Zhang, Di, Cheng, Boying, Huang, Qing-An, Tang, JieyingYear:
2010
Language:
english
DOI:
10.1109/ECTC.2010.5490715
File:
PDF, 651 KB
english, 2010