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[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Understanding lead frame surface treatment and its impact on package reliability
Renyi Wang,, Kuder, R., Bing Wu,, Emmerson, G.T., Seeley, G.J.Year:
2002
Language:
english
DOI:
10.1109/ECTC.2002.1008215
File:
PDF, 1.08 MB
english, 2002