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[IEEE 2007 IEEE International Electron Devices Meeting - Washington, DC, USA (2007.12.10-2007.12.12)] 2007 IEEE International Electron Devices Meeting - TDDB Reliability Prediction Based on the Statistical Analysis of Hard Breakdown Including Multiple Soft Breakdown and Wear-out
Sahhaf, S., Degraeve, R., Roussel, Ph. J., Kauerauf, T., Kaczer, B., Groeseneken, G.Year:
2007
Language:
english
DOI:
10.1109/IEDM.2007.4418984
File:
PDF, 4.50 MB
english, 2007