[IEEE 2012 IEEE Electrical Design of Advanced Packaging and...

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[IEEE 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Taipei, Taiwan (2012.12.9-2012.12.11)] 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Influence of via stubs with different terminations on time-domain transmission waveform and eye diagram in multilayer PCBs

Yeh, Chi-Lou, Tsai, Yi-Chin, Hsu, Che-Ming, Liu, Li-Sang, Tsai, Sheng- Hsun, Kao, Yu Han, Shiue, Guang-Hwa
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Year:
2012
Language:
english
DOI:
10.1109/EDAPS.2012.6469414
File:
PDF, 1.24 MB
english, 2012
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