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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Mechanical properties and electrochemical corrosion behavior of Al-Cu solder joint with Sn-Zn based solder
Kang, Ning, Huang, Mingliang, Zhou, Qiang, Ma, HaitaoYear:
2011
Language:
english
DOI:
10.1109/ICEPT.2011.6066846
File:
PDF, 2.75 MB
english, 2011