[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Process characterization of highly conductive silver paste die attach materials for thin die on QFN
Leong Ching Wai,, Ding Mian Zhi,, Rao, V. S., Rhee, Min Woo DanielYear:
2012
Language:
english
DOI:
10.1109/eptc.2012.6507110
File:
PDF, 1.99 MB
english, 2012