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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Thermal cycling reliability, microstructural characterization, and assembly challenges with backward compatible soldering of a large, high density ball grid array
Vasudevan, Vasu, Coyle, Richard, Aspandiar, Raiyo, Tisdale, Steve, Kinyanjui, Robert, Long, GaryYear:
2011
Language:
english
DOI:
10.1109/ECTC.2011.5898625
File:
PDF, 6.33 MB
english, 2011