[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Simulation of electric field uniformity in through silicon via filling
Haiyong Cao,, Huiqin Ling,, Kaihe Zou,, Ming Li,, Dali M,Year:
2010
Language:
english
DOI:
10.1109/icept.2010.5582372
File:
PDF, 1.99 MB
english, 2010