NiSi Polysilicon Fuse Reliability in 65-nm Logic CMOS...

IEEE Transactions on Device and Materials Reliability 2007 / 06 Vol. 7; Iss. 2

NiSi Polysilicon Fuse Reliability in 65-nm Logic CMOS Technology

Ang, Boon, Tumakha, Sergey, Im, Jay, Paak, Sunhom S.
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Volume:
7
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2007.901870
Date:
June, 2007
File:
PDF, 428 KB
english, 2007
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