Chemical Mechanism of Suppression of Copper Electrodeposition by Poly(ethylene glycol)
Hebert, Kurt R., Adhikari, Saikat, Houser, Jerrod E.Volume:
152
Year:
2005
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1882112
File:
PDF, 111 KB
english, 2005