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[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Analysis of Heat Dissipation Performance of CVD Diamond Film’s Sink for 3D-MCM
Kuojun Xie,, Changshun Jiang,, Haifeng Xu,, Lin Zhu,Year:
2005
Language:
english
DOI:
10.1109/icept.2005.1564629
File:
PDF, 260 KB
english, 2005