[IEEE IEEE 1999 International Interconnect Technology Conference - San Francisco, CA, USA (24-26 May 1999)] Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) - Optimization of damascene feature fill for copper electroplating process
Reid, J., Bhaskaran, V., Contolini, R., Patton, E., Jackson, R., Broadbent, E., Walsh, T., Mayer, S., Schetty, R., Martin, J., Toben, M., Menard, S.Year:
1999
Language:
english
DOI:
10.1109/iitc.1999.787145
File:
PDF, 406 KB
english, 1999