1.3 μm Strain-Compensated InGaAsP Planar Buried...

1.3 μm Strain-Compensated InGaAsP Planar Buried Heterostructure Laser Diodes with a TO-Can Package for Optical Fiber Communications

Tsai, Chia-Lung, Chou, Yi-Lun, Wang, Y. S., Chang, S. J., Wu, Meng-Chyi, Lin, W.
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Volume:
156
Year:
2009
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.3236424
File:
PDF, 442 KB
english, 2009
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