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[IEEE 1999 Proceedings. 49th Electronic Components and Technology Conference - San Diego, CA, USA (1-4 June 1999)] 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) - A testing method and device for intrinsic stress measurement in wafer bumping process
Yifan Guo,, Mitchell, D., Sarihan, V., Shun-Meen Kuo,, Jung-Kai Lin,, Yeung, B., Lee, T., Dawei Zheng,Year:
1999
Language:
english
DOI:
10.1109/ectc.1999.776187
File:
PDF, 637 KB
english, 1999