[IEEE 2013 36th International Spring Seminar on Electronics Technology (ISSE) - Alba Iulia, Romania (2013.05.8-2013.05.12)] Proceedings of the 36th International Spring Seminar on Electronics Technology - Investigations on ultrasonic copper wire wedge bonding for power electronics
Kaestle, Christopher, Khaja, Aarief Syed, Reinhardt, Andreas, Franke, JoergYear:
2013
Language:
english
DOI:
10.1109/isse.2013.6648219
File:
PDF, 908 KB
english, 2013