A computational study on solder bump geometry, normal,...

IEEE Transactions on Electronics Packaging Manufacturing 2002 / 10 Vol. 25; Iss. 4

A computational study on solder bump geometry, normal, restoring, and fillet forces during solder reflow in the presence of liquefied underfill

Yun Zhang,, Renzhe Zhao,, Harris, D.K., Johnson, R.W.
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Volume:
25
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2002.801371
Date:
October, 2002
File:
PDF, 1024 KB
english, 2002
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