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An avionics guide to uprating of electronic parts
Humphrey, D., Condra, L., Pendse, N., Das, D., Wilkinson, C., Pecht, M.G.Volume:
23
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.868863
Date:
January, 2000
File:
PDF, 109 KB
english, 2000