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[IEEE High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - (2007.06.26-2007.06.28)] High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - The Growth Behaviors of IMC Layers in Solid-liquid Interfacial Reactions of Sn1.5Cu/Cu in High Magnetic Field
Cheng, Cong-qian, Zhao, Jie, Xu, Yang, Xu, Fu-min, Huang, Ming-liangYear:
2007
Language:
english
DOI:
10.1109/hdp.2007.4283576
File:
PDF, 2.01 MB
english, 2007