[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Qualification for product development
Weiqiang Wang,, Azarian, Michael H., Pecht, MichaelYear:
2008
Language:
english
DOI:
10.1109/icept.2008.4606933
File:
PDF, 189 KB
english, 2008