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[IEEE 2013 IEEE 15th International Symposium and Exhibition on Advanced Packaging Materials (APM 2013) - Irvine, CA (2013.2.27-2013.3.1)] 2013 IEEE International Symposium on Advanced Packaging Materials - The fluxless soldering process without intermetallic compounds
Shou-Jen Hsu,, Lee, Chin C.Year:
2013
Language:
english
DOI:
10.1109/isapm.2013.6510387
File:
PDF, 3.47 MB
english, 2013