[IEEE IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest. - Tempe, Arizon, USA (Dec. 5, 2005)] IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest. - Integration and optimization of embedded-sige, compressive and tensile stressed liner films, and stress memorization in advanced SOI CMOS technologies
Horstmann, M., Wei, A., Kammler, T., Hntschel, J., Bierstedt, H., Feudel, T., Frohberg, K., Gerhardt, M., Hellmich, A., Hempel, K., Hohage, J., Javorka, P., Klais, J., Koerner, G., Lenski, M., Neu, A.Year:
2005
Language:
english
DOI:
10.1109/iedm.2005.1609315
File:
PDF, 540 KB
english, 2005