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[IEEE 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (2006.7.3-2006.7.3)] 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Backside Fault Isolation Technique in 0.13¿m and 90nm Product Prototyping
Qinfang, Wang, Zhihong, Mai, Kee, Tan, Lam, Jeffrey, Woods, Gary, Cain, Ben, Brown, Douglas, Ross, LarryYear:
2006
Language:
english
DOI:
10.1109/ipfa.2006.251012
File:
PDF, 3.38 MB
english, 2006