[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Wafer level package for the X-band microwave power sensor
De-bo Wang,, Xiao-ping Liao,Year:
2010
Language:
english
DOI:
10.1109/icept.2010.5582671
File:
PDF, 703 KB
english, 2010