[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - 3D chip stacking & reliability using TSV-micro C4 solder interconnection
Au, K. Y., Kriangsak, S. L., Zhang, X. R., Zhu, W. H., Toh, C. H.Year:
2010
Language:
english
DOI:
10.1109/ectc.2010.5490636
File:
PDF, 2.11 MB
english, 2010