[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Modeling lead free solder reliability in SSL applications towards virtual design
Kregting, Rene, Erinc, Muge, Kloosterman, Jan, van Driel, WillemYear:
2012
Language:
english
DOI:
10.1109/esime.2012.6191755
File:
PDF, 1.30 MB
english, 2012