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[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Study on reactive wetting of Sn0.7Cu-xZn lead-free solders on Cu substrate
Hongqin Wang,, Fengjiang Wang,, Xin Ma,, Jun Liu,, Yiyu Qian,Year:
2005
Language:
english
DOI:
10.1109/icept.2005.1564721
File:
PDF, 341 KB
english, 2005