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[IEEE Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, USA (7-9 June 2004)] Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) - Integrated electro-chemical mechanical planarization (Ecmp) for future generation device technology
Economikos, L., Wang, X., Sakamoto, X., Ong, P., Naujok, M., Knarr, R., Chen, L., Moon, Y., Neo, S., Salfelder, J., Duboust, A., Manens, A., Lu, W., Shrauti, S., Liu, F., Tsai, S., Swart, W.Year:
2004
Language:
english
DOI:
10.1109/iitc.2004.1345759
File:
PDF, 239 KB
english, 2004