[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Strain measurement of Fin structure using TEM objective lens dark-field off-axis holography
Zhu, J., Tan, H., Bello, A., Pham, D., Zhou, Y. K., Liu, B. H., Mai, Z. H., Du, A. Y., Zhao, S. P.Year:
2013
Language:
english
DOI:
10.1109/ipfa.2013.6599161
File:
PDF, 799 KB
english, 2013