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[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - New trends in wafer level packaging

Sillon, N., Henry, D., Souriau, J.-C., Brun, J., Boutry, H., Cheramy, S.
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Year:
2009
Language:
english
DOI:
10.1109/iitc.2009.5090390
File:
PDF, 2.06 MB
english, 2009
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