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[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Thermal stress analysis and failure mechanisms for through silicon via array
Chi-Wei Kuo,, Hung-Yin Tsai,Year:
2012
Language:
english
DOI:
10.1109/itherm.2012.6231431
File:
PDF, 1.72 MB
english, 2012