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[IEEE IEEE International Interconnect Technology Conference - Burlingame, CA, USA (2-4 June 2003)] Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) - The improved CVD-Al metallization for deep small contact filling using selective wetting process
Jung Hun Seo,, Byung Hee Kim,, Jong Myeong Lee,, Hee Sook Park,, Ju-Young Yun,, Young Seop Rah,, Gil Heyun Choi,, U In Chung,, Joo-Tae Moon,Year:
2003
Language:
english
DOI:
10.1109/iitc.2003.1219735
File:
PDF, 301 KB
english, 2003