![](/img/cover-not-exists.png)
[IEEE 3rd Electronics Packaging Technology Conference - Singapore (5-7 Dec 2000)] Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) - Heating and reliability characteristics of electrically conductive adhesives using variable frequency microwave cure
Tiebing Wang,, Ying Fu,, Becker, M., Liu, J.Year:
2000
Language:
english
DOI:
10.1109/eptc.2000.906403
File:
PDF, 458 KB
english, 2000