[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Fine pitch “NCF-type compliant-bumped COG”
Chao-Chyun An,, Shyh-Ming Chang,, Ming-Yao Chen,, Kuo-Shu Kao,, Tsang, Jimmy, Sheng-Shu Yang,, Chih Chen,, Chung-Kuang Lin,, Ren-Haw Chen,, Wen-Chih Chen,Year:
2007
Language:
english
DOI:
10.1109/impact.2007.4433558
File:
PDF, 141 KB
english, 2007