[IEEE 1994 Proceedings. 44th Electronic Components and...

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[IEEE 1994 Proceedings. 44th Electronic Components and Technology Conference - Washington, DC, USA (1-4 May 1994)] 1994 Proceedings. 44th Electronic Components and Technology Conference - Memory package with LOC structure using new adhesive material

Nakayoshi, H., Izawa, N., Ishikawa, T., Suzuki, T.
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Year:
1994
Language:
english
DOI:
10.1109/ectc.1994.367535
File:
PDF, 431 KB
english, 1994
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