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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Microstructure changes and compound growth dynamic at lead-free/Cu interface under different conditions
Qi, Lihua, Huang, Jihua, Niu, Jing, Yang, Long, Feng, Yaorong, Zhao, Xingke, Zhang, HuaYear:
2009
Language:
english
DOI:
10.1109/icept.2009.5270590
File:
PDF, 3.92 MB
english, 2009