Asymptotic thermal analysis of electronic packages and...

IEEE Transactions on Components Packaging and Manufacturing Technology Part A 1995 / Dec. Vol. 18; Iss. 4

Asymptotic thermal analysis of electronic packages and printed-circuit boards

Da-Guang Liu,, Phanilatha, V., Qi-Jun Zhang,, Nakhla, M.S.
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Volume:
18
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.477464
Date:
January, 1995
File:
PDF, 693 KB
english, 1995
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