[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - A Comparison Study of the Bondability and Reliability Performance of Au Bonding Wires with Different Dopant Levels
Stephan, D., Chew, Y. H., Goh, H. M., Pasamanero, E., Theint, E.P.P., Calpito, D. R. M., Ling, J.Year:
2007
Language:
english
DOI:
10.1109/eptc.2007.4469780
File:
PDF, 1.84 MB
english, 2007